We are pleased to announce that Kocher+Beck will be participating in LabelExpo in Barcelona. The leading international trade fair for the label and packaging industry offers a unique platform for presenting the latest technologies, trends, and innovations.

As the world’s leading provider of rotary die-cutting technology and system supplier, we will be presenting our solutions in the areas of flexible dies, rotary tools, GapMaster, KMS, and IOC technologies. Visitors will have the opportunity to experience our products up close and talk to our team of experts about customized solutions.

We cordially invite you to visit us at our booth and talk about the future of the label and packaging industry.

Date: September 16–19, 2025

Booth number: Hall 3, Booth E47